Interconnection device



FIG. 1, is a top right hand perspective of a first embodiment of the present invention;

FIG. 2 is a top plan view of the first embodiment;

FIG. 3 is a left side elevation of the present embodiment;

FIG. 4 is a front elevation of the first embodiment;

FIG. 5 is a right side elevation of the first embodiment;

FIG. 6 is a back elevation of the first embodiment;

FIG. 7 is a top, right hand perspective of a second embodiment of the present invention;

FIG. 8 is a top plan view of the second embodiment;

FIG. 9 is a front elevation of the second embodiment;

FIG. 10 is a right side elevation of the second embodiment, the left side being a mirror image; and,

FIG. 11 is a back elevation of the second embodiment. 

The ornamental design for a interconnection device, as shown and described. 